东芝闪存颗粒命名规则?
命名规则:THGAF4G9N4LBAIR(UFS2.1,15nm,MLC)
字符1: T: "Toshiba" 东芝
字符2: H: "Multi-chip" 多芯片封装
字符3: G: Symbol of Type of flash type "IC" 集成电路
字符4: A: Symbol of "voltage type" 表示供电电压类型
字符5: F: NAND Interface type is "UFS" 闪存接口类型为UFS
字符6: 4: Unique code of controller revision 内置控制器版本为4
字符7: G: Memory density calculated by G bits 容量用G bits表示
字符8: 9: Memory density is 2^9=512G bits (64GB) 2的9次方,512G bits,即64GB
字符9: N: Symbol of "cell level" (cell technology) 架构为MLC
字符10: 4: Number of stacked chips is 4 封装内含堆叠芯片数为4
字符11: L: Symbol of "Design rule" 15nm (K for 19nm, J for 24nm) 制程为15nm
字符12-13: BA: Package type is BGA lead free and halogen free 无铅无卤素BGA封装
字符14: I: Symbol of Mode "industrial version" -25ºC to 85ºC 工业版本
字符15: R: Symbol of "Package size" 11.5mmx13mmx1.0mm 封装大小
其中,第9个字符与闪存架构有关:
1)SLC(Single-Level Cell)为S或H;
2)DLC(Dua-Level Cell)为D或E【不常见】;
3)TLC(Triple-Level Cell)为T或U;
4)MLC(Multi-Level Cell)为B、C、J、K、L、N 等。